Method of manufacturing an article comprising at least one electronic chip

ABSTRACT

The present invention provides a method of manufacturing an article comprising a fiber layer and at least one electronic chip, the fiber layer being formed by depositing fibers on a surface immersed in a dispersion of fiber material. The method includes the following step: Using an elongate flexible support to bring the electronic chip into contact with the fiber layer that is being formed.

CROSS-REFERENCE TO RELATED APPLICATION

This is a Continuation of application Ser. No. 10/472,828 filed Dec. 23,2003, which in turn is a National Phase Application of PCT/FR02/02742filed Jul. 30, 2002. This application claims the benefit of France 0110178, filed Jul. 30, 2001. The entire disclosure of the priorapplications is hereby incorporated by reference herein in its entirety.

BACKGROUND

The present invention relates to a method of manufacturing an articlecomprising a fiber layer and at least one electronic chip.

International application WO 99/54842 describes a bank bill made ofpaper having a security thread including an electronic chip ofsemiconductive organic polymer. The security thread includes metallizedportions in order to provide direct contact with apparatus for readingdata stored in the chip, in order to power it electrically. Noindication is given about how the bank bill is manufactured.

German patent application DE 198 33 746 discloses a traveler's checkobtained by placing a strip of polymer material including an electronicchip on a first layer of paper and applying a second layer of paperthereto so that the polymer strip is sandwiched between the two layers.Because of the presence of the above-mentioned strip between the twolayers, the article presents increased thickness all along its length.

German patent application DE 196 01 358 discloses a paper article thatincludes a micromodule embedded in its thickness, the micromodule beingconstituted by an integrated circuit and a metal support.

German patent application DE 196 30 648 discloses a bank bill having aninterrupted security strip and an electronic chip disposed between thetwo portions of the strip.

SUMMARY

The present invention seeks to provide a novel method of manufacturingan article presenting increased security, the article comprising atleast one fiber structure and at least one electronic chip, and inparticular an article in which the risk of the electronic chip beingremoved without damaging the article is reduced and in which theelectronic chip is difficult to identify.

The invention thus provides a method of manufacturing an articlecomprising a fiber layer and at least one electronic chip, the fiberlayer being formed by depositing fibers on a surface immersed in adispersion of fiber material, and the method including the followingstep:

using an elongate flexible support to bring the electronic chip intocontact with the fiber layer that is being formed.

In the invention, the support and the chip can be bonded to the fiberlayer without giving rise to perceptible extra thickness, thus makingthe chip difficult to detect.

In addition, the chip cannot be removed without damaging the article,since it is secured to the support and the support is embedded in thethickness of the fiber layer, possibly being covered completely on bothfaces by the fibers.

The support is advantageously coated, preferably on both faces, in aheat-sealable varnish which improves its behavior within the fiberlayer.

The chip may be placed on an outside surface of the support, withoutbeing embedded therein.

The width of the support may lie in the range 1 millimeter (mm) to 50mm, and in particular in the range 1 mm to 10 mm, for example. It may beelectrically conductive, except possibly where the chip is located,being made of metal or otherwise, being metallized or otherwise, andpossibly being partially made of metal or metallized. When the chipneeds to be connected to an antenna made on the support to enable thechip to operate without contact, the support should be non-conductive,at least in some locations so as to avoid short-circuiting the antennaor the contacts of the chip. The support can thus be non-electricallyconductive, at least where the chip is located.

In an embodiment, the support is oriented relative to the surface onwhich the fibers are deposited during formation of the fiber layer insuch a manner that the chip is situated on the face of the support thatfaces away from said surface. The fiber layer can then cover the chipand its support completely. The support can be brought into contact withthe fiber layer that is being formed once a certain thickness of fibershas already been deposited on said surface, thereby enabling the supportand the chip to be completely embedded in the fiber layer.

In a variant, the support is placed in such a manner as to enable thechip to come into contact with said surface, preferably before it isimmersed. Thus, the chip can be incorporated in the fiber layer whilecoming flush with one face thereof. Such a disposition is advantageous,particularly when the chip is subsequently to be connected to an antennathat is printed or transferred on the fiber layer, as described below,or implemented by other means, such as metallization, demetallization,or photogravure, for example. The above-specified face can then becovered in at least one further layer which may be fibrous ornon-fibrous so that the support and the chip are finally undetectableboth visually and to the touch.

The above-mentioned immersed surface may be defined by the immersedportion of a partially immersed paper-making “wire”, in particular theimmersed portion of a rotary wire cylinder in a papermaking machinehaving a partially immersed cylinder.

In an implementation, the chip is connected to an antenna comprising atleast one turn. The antenna may be carried by the support used forbringing the chip into the dispersion of papermaking fibers. Inparticular, the antenna may extend around the chip on the support. Theantenna may also be disposed entirely on the chip or it may extend atleast in part over the support.

The support and the chip need not necessarily have an antenna. Inparticular, the antenna may be made after the fiber layer has beenformed by printing one or more turns on a face of the fiber layer,preferably by silk-screen printing, using a conductive ink.

In particular, the antenna may be made by means of a method comprisingthe following steps:

using a conductive ink to make a series of turns on a face of the layer;

using an insulating ink to make an insulating bridge over the turns;

using a conductive ink to make a conductive track on the insulatingbridge and connected to one of the ends of the turns; and

connecting the chip to the conductive track and to the other end of theturns by means of a conductive resin.

The antenna may also be made by gravure or by transfer.

The antenna can act as an induction coil, presenting dimensions that aregreater than the dimensions of the chip, so as to enable detection totake place in its proximity or vicinity, having a range of 1 centimeter(cm) to 70 cm, approximately, for example.

As mentioned above, the antenna can also be made directly on the chip,particularly for short-range detection, when a range of 1 mm to 1 cmapproximately suffices.

The chips may be based on silicon.

The chips used may serve solely for reading data, or in a variant, theymay be suitable both for reading and for writing data.

Reading and writing on the chip can be made secure by means of apassword. The transmitted data may be encrypted. The chip may alsocomprise an “anti-collision” system, specifically for use undercircumstances when a plurality of chips are present simultaneously inthe field of a contactless reader apparatus.

The chips may comprise respective programmable microcontrollers.

In a particular implementation of the invention, the support, theantenna, or the chip, in particular a varnish or an encapsulation of thechip, may include authentication elements selected so as to avoiddisturbing the operation of the chip. These authentication elements maybe compounds that are magnetic, opaque, or visible in transmission,compounds that emit light under white, ultraviolet or infrared light, inparticular near-infrared, or biomarkers, this list not being exhaustive.

Advantageously, the thickness of the fiber layer and the nature of thematerial constituting it are selected in such a manner as to protect thechip and the antenna from any impacts associated with processing thefiber layer to make the article, and associated with using the article.

The fiber layer may comprise cellulose fibers and/or artificial orsynthetic fibers and/or cotton linters.

The fiber layer may be a single layer. In a variant, the fiber layerincluding the chip may be assembled with a second layer, e.g. anotherfiber layer, the two layers being bonded by being laminated, forexample.

A plurality of chips and associated supports may be integrated in thefiber layer simultaneously, with the layer subsequently being cut up soas to retain only one chip per article.

The support and the corresponding chip may themselves be cut from stripsof an insulating film, e.g. made of polyester, having the chips fixedthereto, preferably at regular intervals, possibly together with theassociated antennas.

The above-specified strips including the chips may be integrated in asingle web of paper while manufacturing said paper, in a cylindermachine, said paper comprising cellulose fibers and possibly artificialor synthetic fibers.

In an implementation of the invention, an article is made comprising afiber layer and at least one electronic chip by a method comprising thefollowing steps:

introducing a chip by means of a flexible support into a first fibersuspension while making a first web of paper in a papermaking machine,in particular a machine having at least one cylinder;

for each chip, providing the web of paper formed in this way with anantenna;

connecting the antenna to the chip with a conductive resin;

making a second web of paper by means of a endless wire machine orcylinder machine using a second fiber suspension; and

laminating the two previously-made webs together, the chips beingsituated on the inside.

In such an example, the strips carrying the chips do not have antennas,and they are inserted partway into the thickness of the first web ofpaper so that the chips are directly accessible from one side of theweb, the remainder of the strip being embedded in the thickness of thepaper. The antenna can then be applied by printing, transfer, orgravure. The chip does not give rise to any localized extra thicknessand therefore does not modify the outside appearance of the article.

In an implementation of the invention, an article is made comprising afiber layer and at least one electronic chip by a method comprising thefollowing steps:

providing a film having electrically insulating properties at least inthe vicinity of chips and any antennas, provided at preferably regularintervals with antennas;

fixing chips on the film by connecting each chip to an antenna, thechips being disposed at preferably regular intervals on the film;

cutting the film into strips each comprising a line of chips andantennas; and

inserting the strips into paper made up of two united webs each coming,for example, from a cylinder machine, a dual cylinder machine, or acylinder and endless wire machine, etc.

Advantageously, the film is coated in a heat-sealable varnish on bothfaces so as to improve the behavior of the strip in the layer.

The strip carrying the chips may be introduced into the thickness of thefirst web so that the chips are flush with one side of the web, theremainder of the strip being embedded in the thickness of the paper. Thesecond web then covers the first web on the same side as the chips. Theresulting article does not present any localized extra thickness.

The invention also provides an article obtained by implementing theabove-defined method.

Such an article can constitute a cardboard pack, for example.

The article can also be self-adhesive, in particular constituting asticky label. Such a label can comprise a fiber layer including the chipand covered in adhesive on one face.

The invention also provides an article comprising a fiber layer comingfrom a single web of paper, the strip that is not electricallyconductive in the vicinity of the chip extending continuously betweentwo ends of the article, a chip provided with an optionally integratedantenna being fixed on said strip, said strip being entirely covered bythe fibers of the fiber layer as is the chip, the article not presentingany perceptible extra thickness over the chip or the strip.

The invention also provides an article comprising at least two layers,including a fiber layer receiving in its thickness a strip and a chipstuck thereto, an antenna electrically connected to the chip, saidantenna being situated at the interface between the two layers, saidstrip being completely covered by the fibers of the fiber layer. Thestrip also extends continuously between two edges of the article and thearticle does not present any perceptible extra thickness in the vicinityof the strip or the chip. The chip comes flush with the face of thefiber layer that comes into contact with the other layer.

Independently of the above-mentioned aspects, the invention alsoprovides an article comprising:

at least one fiber layer;

an electronic chip in the fiber layer, said chip comprising anintegrated first antenna; and

a second antenna coupled in inductive manner to said integrated firstantenna, without physical electrical contact between the first andsecond antennas.

The second antenna may constitute an authentication element, and inparticular it may be optically variable.

The second antenna may comprise a film which has been demetallized insuch a manner as to create the turns of the antenna. The film may be aholographic film. The second antenna may also be a hologram other than ademetallized hologram.

The electronic chip may be fixed on a support of elongate shape, inparticular a strip, which may be completely covered by the fiber layer.

The support may extend from a first edge of the article to a secondedge, opposite from the first.

BRIEF DESCRIPTION OF THE DRAWINGS

Other characteristics and advantages of the present invention appear onreading the following detailed description of non-limitingimplementations, and on examining the accompanying drawings, in which:

FIG. 1 is a diagram showing a step of the method of manufacturing afiber layer in a first implementation of the invention;

FIG. 2 is a diagrammatic and fragmentary view in cross-section of theresulting fiber layer;

FIG. 3 is a diagrammatic and fragmentary view of a cardboard packincluding a chip;

FIG. 4 is a diagram showing a step in the method of manufacturing afiber layer in a second implementation of the invention;

FIG. 5 is a diagram showing a fragmentary cross-section of the resultingfiber layer;

FIG. 6 is a diagram showing a fragmentary cross-section of an articlecomprising two fiber layers;

FIG. 7 is a fragmentary perspective diagram of a fiber layer having anantenna formed thereon which is connected to the chip;

FIG. 8 is a diagram showing two fiber layers being laminated together;

FIG. 9 is a diagram showing another method of making and assembling twofiber layers;

FIG. 10 is a diagram showing a portion of an adhesive label inaccordance with the invention;

FIG. 11 is a diagrammatic fragmentary view of an article constituting avariant embodiment of the invention; and

FIG. 12 is a diagrammatic fragmentary view of an article constitutinganother variant embodiment of the invention.

DETAILED DESCRIPTION OF EMBODIMENTS

For reasons of clarity, the relative proportions between the variouselements shown in the drawings are not always complied with, the viewsbeing diagrammatic.

FIG. 1 is a fragmentary and diagrammatic view of a cylinder machine formaking paper. The machine comprises a vessel 1 containing a suspension 4of fibers, for example cellulose fibers and/or cotton linters and/orsynthetic and/or artificial fibers, with a rotary wire cylinder 2 beingpartially immersed therein to define a surface 3 having a fiber layer 5being formed continuously in contact therewith.

While it is being formed, an elongate support is incorporated in thefiber layer 5. The support is constituted by a strip 6 carrying on oneface 6 a a plurality of electronic chips 7 disposed at regularintervals. The strip 6 is also referred to as a “thread” since its widthis relatively narrow, for example lying in the range 1 mm to 50 mm. Inthe present application, the terms “thread” and “strip” should beconsidered as being synonyms.

The chips 7 are of passive type, enabling data to be transmitted withoutcontact, each chip being connected to an antenna comprising at least oneturn, and preferably a plurality of turns.

The chips 7 are based on silicon, for example, and they can be about 200micrometers (μm) thick. The thickness of the chips should be selected asa function of the thickness of the fiber layer.

The antennas can be of dimensions greater than the dimensions of thechips, thus making detection possible in the immediate proximity or thevicinity thereof, for example detection at a range of at least 1 cm andpossibly up to 70 cm. In a variant, when short distance detectionsuffices, i.e. at a range of at least 1 mm but not more than about 1 cm,the antenna can be made directly on the same substrate as the chip.

Thus, in the example of FIGS. 1 and 2, each of the chips 7 has anantenna integrated therein. These can be chips sold under the nameIC-Link® by the supplier Inside Technologies, presenting together withthe corresponding antenna dimensions of about 2.2 mm by 2.3 mm and athickness of about 250 μm. These chips operate in read and write modesat a frequency of 13.56 MHz and they can be detected at a distance of upto 5 mm.

The strip 6 is obtained as follows.

To begin with, an epoxy, a cyanoacrylate, or an isocyanate adhesive isused to fix a plurality of chips 7 on a polyester film, e.g. a film thatis about 12 μm thick. Thereafter a heat-sealable varnish is optionallydeposited thereon to reinforce adhesion in the fiber layer, the varnishused possibly including fluorescent or magnetic security compounds. Thevarnish is raised to a temperature which is sufficiently high duringmanufacture of the structure by means of heat from the rollers withwhich the fiber layer comes into contact, for example. Then the film iscut into strips each having a width of about 3 mm, the chips 7 beingplaced on a surface of the film so as to be spaced apart at 20 cm fromone another along the length of each strip 6. The resulting strips 6 arewound on reels while waiting to be integrated in the paper.

Each strip 6 is incorporated in the fiber layer 5 by being brought intocontact with fibers that have just become deposited on the immersedsurface 3 of the cylinder 2, as shown in FIG. 1.

The side 6 b of the strip 6 that does not carry chips 7 faces towardsthe surface 3 of the wire so that the fiber material covers the stripcompletely including its chips 7 when the web of paper leaves thecylinder machine together with the strip 6 and the chips 7.

FIG. 2 shows that the strip 6 and the chips 7 are completely embeddedwithin the thickness of the fiber layer 5 so that the chip 7 is notdetectable visually or to the touch and does not give rise to any extrathickness.

The fiber layer 5 may present a final thickness of about 400 μm andconstitute paper board, for example.

After drying, the fiber layer 5 can be cut so as to form a cardboardpack 9, for example as shown in FIG. 3.

It can be seen that the strip 6 extends continuously between twoopposite edges 10 and 11 of the pack 9. Thus, the strip 6 or the chip 7cannot be removed without damaging the pack 9, given that the force ofadhesion between the chip 7 and the strip 6 is very strong.

It would not go beyond the ambit of the present invention for the chip 7not to be in direct contact with an antenna configured to enable thedetection range to be increased, for example.

By way of example, it is possible to use a chip which is configured tobe capable of coupling with an antenna 15 inductively.

The chip is preferably centered relative to the antenna 15, as shown inFIG. 11.

Since the antenna 15 does not make direct contact with the chip, it canbe made, for example, on the face 5 b of the fiber layer 5 which issituated beside the support 6 or on another web.

The dimensions of the antenna 15 can be significantly larger than thedimensions of the chip, thereby enabling detection to be performed at arelatively great distance.

The chip and antenna assembly as obtained in this way can also presentgood ability to withstand external stresses because of the absence ofany physical connection between the chip and the antenna.

In the example described, it is possible to use an IC-Link® chip asmentioned above, which chip includes an integrated antenna. Said antennais coupled in inductive manner to an antenna 15.

Another fiber layer 17 may optionally be assembled with the fiber layer5, as shown in FIG. 11.

In another implementation of the invention, chips 7 that are initiallynot provided with antennas are stuck onto a film, e.g. a polyester film.The chips 7 can be constituted, for example, by those sold under thename I CODE by the supplier Philips, which chips operate in read andwrite modes at a frequency of 13.56 MHz and can be detected at adistance of up to 1.5 meters (m) depending on the antenna used.

The film is then cut up into strips 6 that are 2 mm wide, with the chips7 being spaced apart on each strip at 20-cm intervals.

As shown in FIG. 4, each strip 6 is brought into the cylinder machineunder controlled tension so that the chips 7 come into contact with thesurface 3 of the wire prior to the fiber material becoming depositedthereon. As a result, the chips 7 are flush in one of the faces 5 a ofthe fiber layer 5, as can be seen in FIG. 5, while the thread 6 isitself embedded.

Thereafter, an antenna 15 can be made for each chip 7 as follows.

A conductive ink, e.g. a silver-based ink, is silkscreen printed on theface 5 a of the fiber layer 5 to form a series of turns. The conductiveink may also include authentication elements selected so as to avoiddisturbing the operation of the chip, for example compounds that arefluorescent, being suitable for being excited by ultraviolet or infraredradiation, or else being constituted by biomarkers. The printed turnshave two ends 15 a and 15 b, with the first end 15 a being close to thechip 7, as can be seen in FIG. 7.

Thereafter, an insulating ink is used to print an insulating bridgepassing over the turns between the two ends 15 a and 15 b, and aconductive ink is used to form a conductive track 16 on the bridge, saidtrack being electrically connected via one end 16 b to the end 15 b ofthe turns. The other end 16 a of the track 16 and the end 15 a of theturns are connected to the chip 7 by means of conductive ink.

The antenna 15 of the FIG. 11 embodiment can also be made using aconductive ink.

In a variant, the antenna 15 described with reference to FIG. 7 or 11can be made by transfer or by gravure.

The antenna 15 can also be put into place on the fiber material in someother way.

The antenna 15 can be obtained, for example, by transferring a hologramcomprising a metal layer that has been locally demetallized, so as toform conductive tracks, as shown in FIG. 12.

The antenna can be present on the outside face 5 a.

Thus, the antenna 15 can also constitute a security element as a resultof the properties of optical variability presented by the hologram.

The antenna 15 can also be made by transferring a metal pattern, e.g. acopper pattern.

The antenna 15 can also be made by electrolytically depositing a metal,for example, on a support previously printed with a conductive inkforming the pattern of the antenna. The support is then assembled withthe fiber layer carrying the chip, e.g. by being laminated therewith.

With reference again to the FIG. 7 embodiment, once the antenna 15 hasbeen connected to the chip 7, the fiber layer 5 is assembled to a secondlayer 17, e.g. a fiber layer presenting a thickness of about 100 μm andcovering the face 5 a.

The two fiber layers 5 and 17 can be assembled together, for example, bylamination using adhesive deposited by a roller 23 between two cylinders20 and 21 of a laminating machine, as shown in FIG. 8, with theresulting paper presenting a total thickness of 400 μm and beingsuitable for cutting out to form a pack such as the pack shown in FIG.3.

As in the preceding example, the resulting pack does not present anyperceptible extra thickness in the zone containing the strip 6 and thechip 7, so they remain undetectable visually or to the touch.

In another implementation of the invention, the support 6 is constitutedby a polyester strip that is 90 μm thick and 4 cm wide. The chips 7which are fixed to said strip 6 can be identical to those of thepreceding example, for example. The antennas can be printed ortransferred onto the support, and each electrically connected to a chip.The antennas can also be made by metallization, demetallization, orphotogravure.

In this example, a two-cylinder machine is used to form a first fiberlayer 30 in which the strip 6 is incorporated in such a manner that thechips 7 are flush with one of the faces of the fiber layer, byproceeding as described with reference to FIG. 4.

The thickness of the first web of paper is about 400 μm, for example.

A second web of paper 31 is made in parallel, having a thickness of 100μm, for example, and the two webs 30 and 31 are assembled together whilein the wet state by passing between the wire cylinder used for makingthe second web 31 and a roller 33, the second web 31 covering the chips7, as shown in FIG. 9.

The resulting card is dried on the papermaking machine at a temperatureof about 100° C. and presents a thickness of 500 μm. As in the precedingexamples, the chips 7 are not detectable either visually or to thetouch.

In another implementation of the invention, after the step ofincorporating chips in the fiber layer 5, as shown in FIG. 4, and afterthe step of making antennas by silkscreen printing, instead ofassembling the fiber layer 5 with a second fiber layer 17, said fiberlayer 5 is dried and then assembled with a silicone-covered protectivefilm 25 that is covered on its face turned towards the fiber layer 5 ina pressure-sensitive adhesive. The protective film 25 is intended to beremoved at the moment of use.

The fiber layer 5 covered in the protective film 25 can be cut so as toform adhesive labels, such as the label shown in FIG. 10, each labelhaving a chip 7.

The chip can be used as a security element in a passport, for example.

Thus, in an implementation of the invention, a 50-μm thick Flexchip®chip is stuck onto a 13-μm thick strip, with the silicon of the chipbeing planed down in order to reduce its thickness.

The strip is incorporated in a fiber layer as in the precedingimplementation, and is then connected to an antenna and laminated withadhesive to the paper covering a passport.

The invention makes it possible to provide effective authenticationmeans, since any attempt at removing the chip will inevitably result inthe article being visibly damaged.

Furthermore, the fiber layer in which the chip is integrated contributesto protecting it against impacts.

Naturally, the invention is not limited to the implementations describedabove.

The fiber layer can receive the treatments that are usual in papermakingand can include conventional elements for preventing falsification andfor providing security.

The chip may perform functions of authentication and/or of traceability.

The chip may also provide protection against theft when its frequencycorresponds to the frequency of detection gates.

1. A method of manufacturing an article comprising a fiber layer and atleast one electronic chip, the fiber layer being formed by depositingfibers on a surface, the method comprising: using an elongate flexiblefilm carrying the at least one electronic chip to bring the at least oneelectronic chip into contact with the surface on which the fiber layeris being formed, wherein the film remains in contact with the fiberlayer in the article manufactured.
 2. A method according to claim 1,wherein the film and the at least one electronic chip are integrated inthe fiber layer without giving rise to perceptible extra thicknessthereof.
 3. A method according to claim 1, wherein the film does notconduct electricity, at least in a location of the at least oneelectronic chip.
 4. A method according to claim 1, wherein the film hasa width lying in a range of 1 mm to 50 mm.
 5. A method according toclaim 4, wherein the film has a width lying in the range of 1 mm to 10mm.
 6. A method according to claim 1, wherein the film is coveredcompletely by fibers of said fiber layer.
 7. A method according to claim1, wherein a heat-sealable varnish is deposited on the film.
 8. A methodaccording to claim 7, wherein the film comprises two faces both coatedwith the heat-sealable varnish.
 9. A method according to claim 7,wherein the varnish is raised to a temperature sufficiently high duringmanufacture by means of heat from the rollers with which the fiber layercomes into contact to improve the adherence of the film to the fiberlayer.
 10. A method according to claim 1, wherein at least one face ofsaid fiber layer is covered by a supplemental layer.
 11. A methodaccording to claim 10, wherein the supplemental layer is fibrous.
 12. Amethod according to claim 10, wherein the supplemental layer isnon-fibrous.
 13. A method according to claim 1, wherein said surface isformed on a partially immersed rotary wire cylinder of a cylindermachine.
 14. A method according to claim 1, wherein the at least oneelectronic chip is fixed on the film.
 15. A method according to claim14, wherein the at least one electronic chip is fixed on the film byadhesive.
 16. A method according to claim 1, wherein the film is made bycutting up into strips a sheet, the at least one electronic chipcomprising electronic chips stuck on the sheet.
 17. A method accordingto claim 16, wherein the electronic chips are placed on the sheet so asto be regularly spaced apart on the film.
 18. A method according toclaim 1, wherein the at least one electronic chip is connected to anantenna comprising at least one turn.
 19. A method according to claim18, wherein the antenna is carried by the film.
 20. A method accordingto claim 19, wherein the antenna extends around the at least oneelectronic chip on the film.
 21. A method according to claim 1, whereinthe antenna is disposed on the at least one electronic chip itself. 22.A method according to claim 1, wherein the film and the at least oneelectronic chip do not have any antenna.
 23. A method according to claim22, wherein the antenna is made on the fiber layer after said layer hasbeen formed.
 24. A method according to claim 23, wherein the antenna ismade by performing the following steps: using an electrically conductiveink to make a series of turns on one face of the fiber layer; using anelectrically insulating ink to make an electrically insulating bridgeover the turns; using an electrically conductive ink to make anelectrically conductive track on the bridge, the track being connectedto one of the ends of the turns; and using an electrically conductiveresin to connect the at least one electronic chip to the electricallyconductive track and to the other end of the turns.
 25. A methodaccording to claim 1, wherein the at least one electronic chip is basedon silicon.
 26. A method according to claim 1, wherein the at least oneelectronic chip is configured to enable data to be transmitted withoutcontact.
 27. A method according to claim 1, wherein the film is made ofpolyester.
 28. A method according to claim 1, wherein the fiber layer isthe only fiber layer in the article.
 29. A method according to claim 1,wherein the article comprises at least two superposed fiber layers,assembled together by lamination, one of the layers comprising the atleast one electronic chip.
 30. A method according to claim 1,comprising: using the flexible film to introduce the at least oneelectronic chip into a first suspension of fibers while making a firstweb of paper in a paper-making machine, the film having no antennas andbeing introduced partway through the thickness of the first web of paperso that the at least one electronic chip is not entirely covered byfibers on one side of the web, the remainder of the at least oneelectronic chip being embedded in the thickness of the paper; providingthe resulting web of paper with an antenna for the at least oneelectronic chip; using an electrically conductive resin to connect theantenna to the at least one electronic chip; using a second suspensionof fibers to make a second web of paper by using an endless wire machineor a cylinder machine; and laminating the two previously-made webstogether with the at least one electronic chips situated on the inside.31. A method according to claim 1, comprising: fixing the at least oneelectronic chip on a sheet of film, wherein the film has electricallyinsulating properties at least in the location of the at least oneelectronic chip; connecting the at least one electronic chip to anantenna; cutting the sheet of film into strips each comprising the atleast one electronic chip and the antenna; and introducing the stripsinto paper formed by uniting two webs, the strip being introduced intothe thickness of the first web so that the at least one electronic chipis embedded in the first web with a side facing away from the stripbeing flush with one side of said first web, the remainder of the stripbeing embedded in the thickness of the paper, the second web coveringthe first web on a side of the at least one electronic chip.
 32. Amethod according to claim 31, wherein the film comprises a coating in aheat-sealable varnish on both faces.
 33. A method according to claim 31,comprising: forming on the film a plurality of antennas disposed atregular intervals.
 34. A method according to claim 31, wherein the atleast one electronic chip comprises a plurality of electronic chipsdisposed at regular intervals on the film.
 35. A method according toclaim 1, wherein at least one of the film, the at least one electronicchip, or a possible antenna, comprises at least one authenticationelement.
 36. A method according to claim 35, wherein the authenticationelement is selected from amongst compounds that are magnetic, opaque, orvisible in transmission, compounds that emit light under white,ultraviolet or infrared light.
 37. A method according to claim 35,wherein the at least one electronic chip comprises at least one of avarnish and an encapsulation having at least one authentication element.38. A method according to claim 35, wherein the at least oneauthentication element comprises at least one compound that emits lightunder near-infrared light.
 39. An article obtained by implementing themethod according to claim
 1. 40. An article according to claim 39,forming a cardboard pack.
 41. A method according to claim 1, wherein thesurface on which the fibers are deposited during formation of the fiberlayer is immersed in a dispersion of fiber material.
 42. A methodaccording to claim 41, wherein the film is placed in such a manner thatthe at least one electronic chip comes into contact with said surfaceprior to immersion of the surface in the dispersion of fiber material.43. A method according to claim 1, wherein the film is completelyembedded in the fiber layer.
 44. A method according to claim 1, whereinthe film extends from a first edge of the article to a second edgeopposite to the first.
 45. A method of manufacturing an articlecomprising at least one fiber layer and at least one electronic chip,the fiber layer being formed by depositing fibers on a surface, themethod comprising: bringing an elongate flexible film carrying the atleast one electronic chip into contact with the fiber layer that isbeing formed, wherein the film remains in contact with the fiber layerin the article manufactured and the at least one electronic chip is notentirely covered by the fiber layer in the article manufactured.
 46. Amethod according to claim 45, wherein the at least one electronic chipis embedded in the fibers with the side facing away from the strip beingflush with the fiber layer in the manufactured article.
 47. An articlecomprising: a fiber layer coming from a single web of paper, a filmextending continuously between two ends of the article, and anelectronic chip carried by the film, the film being completely coveredby the fibers of the fiber layer, and the electronic chip not beingcompletely covered by the fibers of the fiber layer.
 48. An articlecomprising at least two layers comprising at least one fiber layer, astrip of film received in the at least one fiber layer, an electronicchip carried by the strip in a thickness of the fiber layer, and anantenna electrically connected to the electronic chip, said antennabeing situated at the interface between the at least two layers, saidstrip being completely covered by the fibers of the fiber layer, thestrip extending continuously between two edges of the article and thearticle not presenting any perceptible extra thickness over the strip orthe electronic chip, said electronic chip coming flush with the face ofthe at least one fiber layer that is in contact with the other layer.49. A method of manufacturing an article comprising at least one fiberlayer and at least one electronic chip, the method comprising: formingthe fiber layer by depositing fibers on a surface, using an elongateflexible film carrying the at least one electronic chip to bring the atleast one electronic chip into contact with the fiber layer, the filmcomprising a coating of a heat-sealable varnish, and raising the varnishto a temperature sufficiently high during manufacture by means of heatfrom the rollers with which the fiber layer comes into contact.
 50. Amethod according to claim 49, wherein the at least one electronic chipcomprises an integrated induction antenna comprising at least one turn.51. A method according to claim 49, wherein the at least one electronicchip is not covered entirely with the fibers of the fiber layer.
 52. Anarticle comprising: a fiber layer coming from a single web of paper,film carrying at least one electronic chip, the film extending betweentwo ends of the article within the fiber layer, and a coating of anactivated heat-sealable varnish deposited on the film.
 53. An articleaccording to claim 52, wherein the at least one electronic chipcomprises an integrated induction antenna comprising at least one turn.